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最新推出无铅中温Sn/Bi/Cu合金锡膏—PF-3005-C

作者:张建斌 2021-10-19 0

OB欧宝体育首页 金属有限公司最新推出无铅中温Sn/Bi/Cu合金锡膏,型号:中温锡膏PF-3005-C具特性如下:

1. 熔点低(146190℃),焊接温度接近锡铅锡膏,对元器件和板材耐热性要求低,生产工艺窗口大;

2. 相对于目前常用的无铅合金锡膏(如Sn/Ag/CuSn/Bi/Ag),成本低;

3. 热导性好,在散热模组产品上应用此产品,其热导率比Sn/Bi合金增高一倍左右;

4. 此合金机械强度接近Sn/Ag/Cu合金。

4. 此产品采用球形度好、颗粒度分布均匀的锡粉炼制而成,粘度适中,适应各种涂布方法;

5. 印刷滚动性、脱膜性及抗坍塌性均表现优良,可有效解决密间距和小元件的焊盘印刷;

6. 润湿性好,能适应不同的金属镀层;焊后板面残留极少且透明、阻抗高,焊点平滑饱满;

7. 此款合金锡膏可作为Sn/Ag/Cu合金(表面贴装和通孔涂布工艺)及Sn/Bi(散热模组)类型产品的替代品;可有效地缓解焊料行业中对Ag需求的剧烈增加和避免无铅的高温焊接;解决了Sn/Bi焊料在散热模组产品上的低热导问题。


        Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.


附本锡膏应用案例:

1、应用于散热器的焊接

2、应用于表面贴装

电路板